欢迎访问ic37.com |
会员登录 免费注册
发布采购

S29AL004D70MFI013 参数 Datasheet PDF下载

S29AL004D70MFI013图片预览
型号: S29AL004D70MFI013
PDF下载: 下载PDF文件 查看货源
内容描述: 4兆位( 512 Kx的8位/ 256千×16位) CMOS 3.0伏只引导扇区闪存 [4 Megabit (512 Kx 8-Bit/256 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory]
分类和应用: 闪存
文件页数/大小: 55 页 / 1488 K
品牌: SPANSION [ SPANSION ]
 浏览型号S29AL004D70MFI013的Datasheet PDF文件第1页浏览型号S29AL004D70MFI013的Datasheet PDF文件第2页浏览型号S29AL004D70MFI013的Datasheet PDF文件第3页浏览型号S29AL004D70MFI013的Datasheet PDF文件第4页浏览型号S29AL004D70MFI013的Datasheet PDF文件第6页浏览型号S29AL004D70MFI013的Datasheet PDF文件第7页浏览型号S29AL004D70MFI013的Datasheet PDF文件第8页浏览型号S29AL004D70MFI013的Datasheet PDF文件第9页  
A d v a n c e I n f o r m a t i o n  
General Description  
The S29AL004D is a 4 Mbit, 3.0 volt-only Flash memory organized as 524,288  
bytes or 262,144 words. The device is offered in 48-ball FBGA, 44-pin SO, and  
48-pin TSOP packages. The word-wide data (x16) appears on DQ15–DQ0; the  
byte-wide (x8) data appears on DQ7–DQ0. This device requires only a single, 3.0  
volt V  
supply to perform read, program, and erase operations. A standard  
CC  
EPROM programmer can also be used to program and erase the device.  
This device is manufactured using Spansion’s 200nm process technology, and of-  
fers all the features and benefits of the Am29LV400B and MBM29LV400T/BC,  
which were manufactured using 320nm process technology.  
The standard device offers access times of 70 and 90ns, allowing high speed mi-  
croprocessors to operate without wait states. To eliminate bus contention the  
device has separate chip enable (CE#), write enable (WE#) and output enable  
(OE#) controls.  
The device requires only a single 3.0 volt power supply for both read and write  
functions. Internally generated and regulated voltages are provided for the pro-  
gram and erase operations.  
The device is entirely command set compatible with the JEDEC single-power-  
supply Flash standard. Commands are written to the command register using  
standard microprocessor write timings. Register contents serve as input to an in-  
ternal state-machine that controls the erase and programming circuitry. Write  
cycles also internally latch addresses and data needed for the programming and  
erase operations. Reading data out of the device is similar to reading from other  
Flash or EPROM devices.  
Device programming occurs by executing the program command sequence. This  
initiates the Embedded Program algorithm—an internal algorithm that auto-  
matically times the program pulse widths and verifies proper cell margin. The  
Unlock Bypass mode facilitates faster programming times by requiring only two  
write cycles to program data instead of four.  
Device erasure occurs by executing the erase command sequence. This initiates  
the Embedded Erase algorithm—an internal algorithm that automatically  
preprograms the array (if it is not already programmed) before executing the  
erase operation. During erase, the device automatically times the erase pulse  
widths and verifies proper cell margin.  
The host system can detect whether a program or erase operation is complete by  
observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (tog-  
gle) status bits. After a program or erase cycle is completed, the device is ready  
to read array data or accept another command.  
The sector erase architecture allows memory sectors to be erased and repro-  
grammed without affecting the data contents of other sectors. The device is fully  
erased when shipped from the factory.  
Hardware data protection measures include a low V detector that automat-  
CC  
ically inhibits write operations during power transitions. The hardware sector  
protection feature disables both program and erase operations in any combina-  
tion of the sectors of memory. This can be achieved in-system or via  
programming equipment.  
February 18, 2005 S29AL004D_00_A1  
S29AL004D  
3
 复制成功!