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AM29DL322GB90EI 参数 Datasheet PDF下载

AM29DL322GB90EI图片预览
型号: AM29DL322GB90EI
PDF下载: 下载PDF文件 查看货源
内容描述: 32兆位( 4米×8位/ 2的M× 16位) CMOS 3.0伏只,同时操作闪存 [32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory]
分类和应用: 闪存
文件页数/大小: 58 页 / 1293 K
品牌: SPANSION [ SPANSION ]
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D A T A S H E E T  
TABLE OF CONTENTS  
Unlock Bypass Command Sequence ................................... 26  
Figure 3. Program Operation.............................................................................................. 26  
Chip Erase Command Sequence ............................................ 26  
Sector Erase Command Sequence ......................................... 27  
Erase Suspend/Erase Resume Commands ............................ 27  
Figure 4. Erase Operation................................................................................................... 28  
Table 14. Command Definitions......................................................................................... 29  
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4  
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8  
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10  
Table 1. Device Bus Operations ........................................................................................ 10  
Word/Byte Configuration .......................................................... 10  
Requirements for Reading Array Data .....................................10  
Writing Commands/Command Sequences ..............................11  
Accelerated Program Operation ...........................................11  
Autoselect Functions .............................................................11  
Simultaneous Read/Write Operations  
with Zero Latency .....................................................................11  
Standby Mode .......................................................................... 11  
Automatic Sleep Mode .............................................................11  
RESET#: Hardware Reset Pin .................................................12  
Output Disable Mode ...............................................................12  
Table 2. Device Bank Divisions .......................................................................................... 12  
Table 3. Top Boot Sector Addresses ...............................................................................13  
Table 4. Top Boot Secured Silicon Sector Addresses .................................................... 14  
Table 5. Bottom Boot Sector Addresses ........................................................................... 15  
Table 6. Bottom Boot Secured Silicon Sector Addresses ............................................. 16  
Autoselect Mode ...................................................................... 17  
Table 7. Autoselect Codes, (High Voltage Method) ....................................................... 17  
Sector/Sector Block Protection and Unprotection .................... 18  
Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection .........18  
Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...18  
Write Protect (WP#) .................................................................19  
Temporary Sector Unprotect ....................................................19  
Figure 1. Temporary Sector Unprotect Operation........................................................... 19  
Figure 2. In-System Sector Protection/  
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30  
DQ7: Data# Polling .................................................................. 30  
Figure 5. Data# Polling Algorithm....................................................................................... 30  
RY/BY#: Ready/Busy# ..............................................................31  
DQ6: Toggle Bit I ..................................................................... 31  
Figure 6. Toggle Bit Algorithm............................................................................................. 31  
DQ2: Toggle Bit II .................................................................... 32  
Reading Toggle Bits DQ6/DQ2 ................................................ 32  
DQ5: Exceeded Timing Limits ................................................. 32  
DQ3: Sector Erase Timer ........................................................ 32  
Table 15. Write Operation Status .......................................................................................33  
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34  
Figure 7. Maximum Negative Overshoot Waveform....................................................... 34  
Figure 8. Maximum Positive Overshoot Waveform......................................................... 34  
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35  
Figure 9. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)...... 36  
Figure 10. Typical ICC1 vs. Frequency................................................................................ 36  
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
Figure 11. Test Setup.......................................................................................................... 37  
Figure 12. Input Waveforms and Measurement Levels.................................................. 37  
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38  
Figure 13. Read Operation Timings................................................................................... 38  
Figure 14. Reset Timings..................................................................................................... 39  
Word/Byte Configuration (BYTE#) ........................................... 40  
Figure 15. BYTE# Timings for Read Operations............................................................. 40  
Figure 16. BYTE# Timings for Write Operations.............................................................. 40  
Erase and Program Operations ............................................... 41  
Figure 17. Program Operation Timings............................................................................. 42  
Figure 18. Accelerated Program Timing Diagram........................................................... 42  
Figure 19. Chip/Sector Erase Operation Timings............................................................ 43  
Figure 20. Back-to-back Read/Write Cycle Timings........................................................ 44  
Figure 21. Data# Polling Timings (During Embedded Algorithms)............................... 44  
Figure 22. Toggle Bit Timings (During Embedded Algorithms)..................................... 45  
Figure 23. DQ2 vs. DQ6...................................................................................................... 45  
Temporary Sector Unprotect ................................................... 46  
Figure 24. Temporary Sector Unprotect Timing Diagram.............................................. 46  
Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram...................... 47  
Alternate CE# Controlled Erase and Program Operations ...... 48  
Figure 26. Alternate CE# Controlled Write (Erase/Program) Operation Timings........ 49  
Sector Unprotection Algorithms.......................................................................................... 20  
Secured Silicon Sector  
Flash Memory Region ..............................................................21  
Factory Locked: Secured Silicon Sector Programmed and Pro-  
tected At the Factory .............................................................21  
Customer Lockable: Secured Silicon Sector NOT Programmed  
or Protected At the Factory ...................................................21  
Hardware Data Protection ........................................................21  
Low VCC Write Inhibit ...........................................................22  
Write Pulse “Glitch” Protection ..............................................22  
Logical Inhibit ........................................................................22  
Power-Up Write Inhibit ..........................................................22  
Common Flash Memory Interface (CFI) . . . . . . . 22  
Table 10. CFI Query Identification String.......................................................................... 22  
Table 11. System Interface String...................................................................................... 23  
Table 12. Device Geometry Definition............................................................................... 23  
Table 13. Primary Vendor-Specific Extended Query...................................................... 24  
Erase And Programming Performance . . . . . . . 50  
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 50  
TSOP Pin and Fine-Pitch BGA Capacitance. . . . 50  
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51  
FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA)  
8 x 14 mm ................................................................................ 51  
FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm ..................... 52  
TS 048—Thin Small Outline Package ..................................... 53  
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55  
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24  
Reading Array Data ..................................................................24  
Reset Command ......................................................................25  
Autoselect Command Sequence ..............................................25  
Enter Secured Silicon Sector/Exit Secured Silicon Sector Com-  
mand Sequence .......................................................................25  
Byte/Word Program Command Sequence ...............................25  
December 4, 2006 25686B10  
Am29DL32xG  
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