A D V A N C E
I N F O R M A T I O N
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Am29DL163D/
Am29DL164D
T
70
E
I
OPTIONAL PROCESSING
Blank = Standard Processing
B
= Burn-In
N
= 16-byte ESN devices
(Contact an AMD representative for more information)
TEMPERATURE RANGE
C
= Commercial (0
°
C to +70
°
C)
I
= Industrial (–40
°
C to +85
°
C)
E
= Extended (–55°C to +125°C)
PACKAGE TYPE
E
= 48-Pin Thin Small Outline Package
(TSOP) Standard Pinout (TS 048)
Z
= 56-Pin Shrink Small Outline Package (SSO056)
WC = 48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package (FBC048)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
=
Top sector
B
=
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29DL163D/Am29DL164D
16Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations for TSOP and SSOP Packages
AM29DL163DT70R,
AM29DL163DB70R
AM29DL163DT70,
AM29DL163DB70
AM29DL163DT90,
AM29DL163DB90
AM29DL163DT120,
AM29DL163DB120
ZC
Valid Combinations for FBGA Packages
Order Number
AM29DL163DT70,
AM29DL163DB70
AM29DL164DT80,
AM29DL164DB80
AM29DL163DT90,
AM29DL163DB90
AM29DL164DT90,
AM29DL164DB90
AM29DL163DT120,
AM29DL163DB120
AM29DL164DT120,
AM29DL164DB120
WCI,
WCE
Package Marking
D163DT70V,
D163DB70V
D164DT80V,
D164DB80V
D163DT90V,
D163DB90V
D164DT90V,
D164DB90V
D163DT12V,
D163DB12V
D164DT12V,
D164DB12V
EI
EI, ZI
EI, EE, ZI, ZE
Valid Combinations
WCI
I
Valid Combinations list configurations planned to be supported in
volume for this device. Consult the local AMD sales office to con-
firm availability of specific valid combinations and to check on
newly released combinations.
I, E
Note:
Contact AMD for availability information on Am29DL162 devices.
Am29DL163D/Am29DL164D
7
SPANSION [ SPANSION ]
