P R E L I M I N A R Y
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Am29DL162C/Am29DL163C
T
70
E
I
OPTIONAL PROCESSING
Blank = Standard Processing
B
N
=
=
Burn-In
16-byte ESN devices
(Contact an AMD representative for more information)
TEMPERATURE RANGE
I
=
Industrial (–40°C to +85°C)
Extended (–55°C to +125°C)
E
=
PACKAGE TYPE
E
=
48-Pin Thin Small Outline Package
(TSOP) Standard Pinout (TS 048)
Z
=
=
56-Pin Shrink Small Outline Package (SSO056)
WC
48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package (FBC048)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
B
=
=
Top sector
Bottom sector
DEVICE NUMBER/DESCRIPTION
Am29DL162C/Am29DL163C
16Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS Flash Memory
3.0 Volt-only Read, Program, and Erase
Valid Combinations for TSOP and SSOP Packages
Valid Combinations for FBGA Packages
Order Number Package Marking
AM29DL162CT70,
AM29DL162CT70,
AM29DL162CB70
D162CT70V,
D162CB70V
AM29DL163CT70,
AM29DL162CB70
AM29DL163CB70
EI, ZI
AM29DL162CT90,
AM29DL163CT70,
AM29DL163CB70
D163CT70V,
D163CB70V
AM29DL162CB90
WCI
I
AM29DL163CT90,
AM29DL163CB90
AM29DL162CT90,
AM29DL162CB90
D162CT90V,
D162CB90V
AM29DL162CT120,
AM29DL163CT90,
AM29DL163CB90
D163CT90V,
D163CB90V
AM29DL162CB120
EI, EE, ZI, ZE
AM29DL163CT120,
AM29DL162CT120,
AM29DL162CB120
D162CT12V,
D162CB12V
AM29DL163CB120
WCI,
WCE
I, E
Valid Combinations
AM29DL163CT120,
AM29DL163CB120
D163CT12V,
D163CB12V
Valid Combinations list configurations planned to be supported in
volume for this device. Consult the local AMD sales office to con-
firm availability of specific valid combinations and to check on
newly released combinations.
7
Am29DL162C/Am29DL163C
SPANSION [ SPANSION ]
