D A T A S H E E T
PHYSICAL DIMENSIONS
VBD064—64-ball Fine-Pitch Ball Grid Array (BGA) 9 x 8 mm Package
D
D1
A
0.05
(2X)
C
8
7
6
5
7
e
SE
E
B
E1
4
3
2
1
H
G
F
E
C
B
A
D
INDEX MARK
10
PIN A1
CORNER
A1 CORNER
SD
6
NXφb
0.05
(2X)
C
φ 0.08
φ 0.15
M
M
C
TOP VIEW
C A B
BOTTOM VIEW
0.10
C
A2
A
0.08 C
A1
SEATING PLANE
C
SIDE VIEW
NOTES:
PACKAGE
JEDEC
VBD 064
N/A
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
8.95 mm x 7.95 mm NOM
PACKAGE
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL
MIN
---
NOM
---
MAX
1.00
0.30
0.76
NOTE
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
OVERALL THICKNESS
BALL HEIGHT
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
0.20
0.62
---
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
---
BODY THICKNESS
BODY SIZE
8.95 BSC.
7.95 BSC.
5.60 BSC.
5.60 BSC.
8
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E
BODY SIZE
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
D1
E1
MD
ME
N
BALL FOOTPRINT
BALL FOOTPRINT
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
8
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
64
φb
0.30
0.35
0.40
BALL DIAMETER
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
e
0.80 BSC.
0.40 BSC.
NONE
BALL PITCH
SD / SE
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3246 \ 16-038.9
Note: BSC is an ANSI standard for Basic Space Centering
86
Am29BDS128H/Am29BDS640H
27024B3 May 10, 2006
SPANSION [ SPANSION ]
