Integrated USB 2.0 Compatible 7-Port Hub
Datasheet
Chapter 9 Package Outline
Figure 9.1 80 Pin TQFP Package Outline (12x12x1.4 mm body - 2 mm footprint)
Table 9.1 80 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
A1
A2
D
1.40
0.05
1.35
13.80
11.80
13.80
11.80
0.09
0.45
~
~
~
1.60
0.15
1.45
14.20
12.20
14.20
12.20
0.20
0.75
~
Overall Package Height
Standoff
1.40
Body Thickness
X Span
14.00
12.00
14.00
12.00
~
D1
E
X body Size
Y Span
E1
H
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
L
0.60
L1
e
1.00 REF.
0.50 Basic
~
q
0o
0.17
~
7o
Lead Foot Angle
Lead Width
W
ccc
0.18
0.27
0.08
~
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane
H.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 2.3 (08-27-07)
SMSC USB2507
DATA4S4HEET
SMSC [ SMSC CORPORATION ]
