High-Performance Single-Chip 10/100 Ethernet Controller with HP Auto-MDIX
Datasheet
Chapter 8 Package Outline
Figure 8.1 100 Pin TQFP Package Definition
Table 8.1 100 Pin TQFP Package Parameters
MIN
~
NOMINAL
MAX
1.60
REMARKS
Overall Package Height
A
~
A1
A2
D
D1
E
E1
H
L
0.05
1.35
15.80
13.90
15.80
13.90
0.09
0.45
~
~
~
~
~
~
~
~
0.60
0.15
1.45
16.20
14.10
16.20
14.10
0.20
0.75
~
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
L1
e
1.00
0.50 Basic
Lead Pitch
q
0o
0.17
0.08
0.08
~
~
0.22
~
~
~
7o
0.27
~
0.20
0.08
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
W
R1
R2
ccc
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.5 (07-18-06)
130
SMSC LAN9218
DATASHEET
SMSC [ SMSC CORPORATION ]
