10/100 Non-PCI Ethernet Single Chip MAC + PHY
Datasheet
Figure 15.2 128 Pin QFP Package Outline, 3.9 MM Footprint
Table 15.2 128 Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
3.4
Overall Package Height
Standoff
A1
A2
D
0.05
2.55
23.70
11.85
19.90
17.70
8.85
13.90
~
~
0.5
~
3.05
24.10
12.05
20.10
18.10
9.05
14.10
~
Body Thickness
23.90
11.95
20.0
17.90
8.95
14.00
~
X Span
D/2
D1
E
E/2
E1
H
L
L1
e
q
W
R1
R2
ccc
ccc
1/2 X Span Measured from Centerline
X body Size
Y Span
1/2 Y Span Measured from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
0.73
~
0.88
1.95
1.03
~
0.5 Basic
0o
~
~
~
~
~
~
7o
0.30
~
0.30
0.0762
0.08
0.10
0.13
0.13
~
~
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is + 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.8 (07-13-05)
142
SMSC LAN91C111-REV B
DATASHEET
SMSC [ SMSC CORPORATION ]
