High-Performance Single-Chip 10/100 Non-PCI Ethernet Controller
Package Outline
Figure 3 100 Pin TQFP Package Outline
Table 1 100 Pin TQFP Package Parameters
A
A1
A2
D
D1
E
E1
H
L
L1
e
MIN
~
0.05
1.35
15.80
13.90
15.80
13.90
0.09
0.45
~
0
o
0.17
0.08
0.08
~
NOMINAL
~
~
~
~
~
~
~
~
0.60
1.00
0.50 Basic
~
0.22
~
~
~
MAX
1.60
0.15
1.45
16.20
14.10
16.20
14.10
0.20
0.75
~
7
o
0.27
~
0.20
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
θ
W
R1
R2
ccc
Notes:
1
2
3
4
5
Controlling Unit: millimeter.
Tolerance on the true position of the leads is ± 0.04 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 0.5 (09-09-04)
PRODUCT PREVIEW
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SMSC LAN9118
SMSC [ SMSC CORPORATION ]
