欢迎访问ic37.com |
会员登录 免费注册
发布采购

COM20020I3V-HT 参数 Datasheet PDF下载

COM20020I3V-HT图片预览
型号: COM20020I3V-HT
PDF下载: 下载PDF文件 查看货源
内容描述: 5Mbps的ARCNET ( ANSI 878.1 )控制器2K ×8片内RAM [5Mbps ARCNET (ANSI 878.1) Controller with 2K x 8 On-Chip RAM]
分类和应用: 外围集成电路数据传输控制器局域网时钟
文件页数/大小: 65 页 / 472 K
品牌: SMSC [ SMSC CORPORATION ]
 浏览型号COM20020I3V-HT的Datasheet PDF文件第1页浏览型号COM20020I3V-HT的Datasheet PDF文件第2页浏览型号COM20020I3V-HT的Datasheet PDF文件第4页浏览型号COM20020I3V-HT的Datasheet PDF文件第5页浏览型号COM20020I3V-HT的Datasheet PDF文件第6页浏览型号COM20020I3V-HT的Datasheet PDF文件第7页浏览型号COM20020I3V-HT的Datasheet PDF文件第8页浏览型号COM20020I3V-HT的Datasheet PDF文件第9页  
5Mbps ARCNET (ANSI 878.1) Controller with 2K x 8 On-Chip RAM  
TABLE OF CONTENTS  
2.0  
3.0  
4.0  
5.0  
GENERAL DESCRIPTION..............................................................................................................................5  
PIN CONFIGURATIONS .................................................................................................................................6  
DESCRIPTION OF PIN FUNCTIONS FOR TQFP ..........................................................................................8  
PROTOCOL DESCRIPTION.........................................................................................................................11  
5.1  
5.2  
5.3  
5.4  
5.5  
5.6  
NETWORK PROTOCOL ..................................................................................................................................11  
DATA RATES ...............................................................................................................................................11  
NETWORK RECONFIGURATION.......................................................................................................................12  
BROADCAST MESSAGES ...............................................................................................................................12  
EXTENDED TIMEOUT FUNCTION.....................................................................................................................12  
LINE PROTOCOL ..........................................................................................................................................13  
6.0  
SYSTEM DESCRIPTION...............................................................................................................................15  
6.1  
6.2  
MICROCONTROLLER INTERFACE ....................................................................................................................15  
TRANSMISSION MEDIA INTERFACE .................................................................................................................19  
7.0  
FUNCTIONAL DESCRIPTION......................................................................................................................24  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
MICROSEQUENCER ......................................................................................................................................24  
INTERNAL REGISTERS...........................................................................................................................25  
INTERNAL RAM ............................................................................................................................................35  
COMMAND CHAINING....................................................................................................................................40  
INITIALIZATION SEQUENCE ............................................................................................................................42  
IMPROVED DIAGNOSTICS ..............................................................................................................................42  
8.0  
OPERATIONAL DESCRIPTION ...................................................................................................................45  
8.1  
8.2  
MAXIMUM GUARANTEED RATINGS*................................................................................................................45  
DC ELECTRICAL CHARACTERISTICS ...............................................................................................................45  
9.0  
TIMING DIAGRAMS......................................................................................................................................48  
PACKAGE OUTLINES..................................................................................................................................60  
APPENDIX A.................................................................................................................................................62  
10.0  
11.0  
12.0  
APPENDIX B.................................................................................................................................................65  
12.1  
SOFTWARE IDENTIFICATION OF THE COM20020I REV B, REV C AND REV D.....................................................65  
LIST OF FIGURES  
Figure 1 - COM20020I OPERATION ...........................................................................................................................10  
Figure 2 - MULTIPLEXED, 8051-LIKE BUS INTERFACE WITH RS-485 INTERFACE...............................................16  
Figure 3 - NON-MULTIPLEXED, 6801-LIKE BUS INTERFACE WITH RS-485 INTERFACE......................................17  
Figure 4 - HIGH SPEED CPU BUS TIMING - INTEL CPU MODE...............................................................................18  
Figure 5 - COM20020I NETWORK USING RS-485 DIFFERENTIAL TRANSCEIVERS................................................20  
Figure 6 - DIPULSE WAVEFORM FOR DATA OF 1-1-0.............................................................................................20  
Figure 7 - INTERNAL BLOCK DIAGRAM ....................................................................................................................22  
Figure 8 – SEQUENTIAL ACCESS OPERATION........................................................................................................35  
Figure 9 – RAM BUFFER PACKET CONFIGURATION ..............................................................................................38  
Figure 10 - COMMAND CHAINING STATUS REGISTER QUEUE...............................................................................40  
Figure 11 - MULTIPLEXED BUS, 68XX-LIKE CONTROL SIGNALS; READ CYCLE ..................................................48  
Figure 12 - MULTIPLEXED BUS, 80XX-LIKE CONTROL SIGNALS; READ CYCLE ..................................................49  
Figure 13 - MULTIPLEXED BUS, 68XX-LIKE CONTROL SIGNALS; WRITE CYCLE.................................................50  
SMSC COM20020I 3.3V  
Page 3  
Revision 12-06-06  
DATASHEET  
 复制成功!