DATA SHEET • CLA SERIES DIODES
50 Ω
Connector
0.020 in.
Typ.
0.001 in. Gold Wire
Bond, Typical
Ground
Plane
Solder or
Epoxy Die Bond
Microstrip Board
TFG 0.006 in. Thick, Typical
Figure 6. Diodes in 50 Ω Microstrip Circuit (Side View)
Diode, Typical
TFG Board
Ground
Return
50 Ω
X1
X2
Conductor
0.022 in., Typical
Figure 7. Diodes in 50 Ω Microstrip Circuit (Top View)
Coil for Ground Return
X1
X2
50 Ω
50 Ω
CJ
R
R
C
J
R
P
CJ
R
P
Figure 8. Low-Level Equivalent Circuit
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
September 28, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200100I
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