ST7565S
ST7565S Pad Arrangement(COG)
Chip Size
Bump Pitch
Bump Height
Chip Thickness
PAD No
9,336ꢀm x 1,000ꢀm
58ꢀm (Min.)
18ꢀm(Typ)
635ꢀm
Bump Size
40ꢀm x 90ꢀm
56ꢀm x 60ꢀm
40ꢀm x 90ꢀm
90ꢀm x 25.5ꢀm
90ꢀm x 40ꢀm
40ꢀm x 90ꢀm
90ꢀm x 40ꢀm
90ꢀm x 25.5ꢀm
001 ~ 012
013 ~ 102
103 ~ 114
115
116 ~ 128
129 ~ 276
277 ~ 289
290
ꢀ
Use select pin to define display duty as following table
SEL 3 , 2 , 1
0 , 0 , 0
DUTY
1/65
1/49
1/33
1/55
1/53
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BIAS
1/9 or 1/7
1/8 or 1/6
1/6 or 1/5
1/8 or 1/6
1/8 or 1/6
-----
0 , 0 , 1
0 , 1 , 0
0 , 1 , 1
1 , 0 , 0
1, X , X
Ver 0.6c
2/72
2009/09/07