點晶科技股份有限公司
SILICON TOUCH TECHNOLOGY INC.
42-DL211
REQUIREMENTS FOR WAFER DELIVERY
Material： Silicon with P-Substrate
Diameter： 6 inches(≒15cm)
Thickness： 12 mils(≒300um)
Malfunctioned die：Marked with red ink or equivalent marking
HANDLING RECOMMENDATION FOR STATIC ELECTRICITY PROTECTION
(1) Avoid any circumstance that produce static electricity, e.g. rubbing against plastic, during
moving, storing and processing 42-DL211.
(2) Process 42-DL211 in a clean room with proper temperature and humidity.
(3) Ground all working machines and workers wear anti-electrostatic ring to ground during
processing.
(4) Avoid contact 42-DL211with bare hands .If unavoided, wear anti-electrostatic ring and use
anti-electrostatic tool to pick it up.
GUARANTED TEMPERATURE AND RETENTION CYCLE
(1) The device/wafer 42-DL211 should be stored in the nitrogenous chest. The conditions suggested
are as follows:
Temperature = 23±3℃
Relative Humidity = 50±10%
Minimum nitrogen inflow = 3 liters/minute
(2) If the device/wafer, 42-DL211 is incidentally exposed to the air, use it for manufacturing as soon
as possible.
(3) Under the storage environment specified in item (1), six-month safe storage period is
guaranteed.
SP-DL211-A.005.doc
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Version：A.005
SITI [ SILICON TOUCH TECHNOLOGY INC. ]
