1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
85030
01
X
X
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
⎮
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit function
01, 02
03, 04
05, 06
2700
2702
2701
Precision +10.000-volt reference
Precision ±10.000-volt reference
Precision -10.000-volt reference
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
X
Y
3
GDIP1-T14, CDIP1-T14
See figure 1
14
14
14
28
Dual-in-line
Dual-in-line
Dual-in-line
Square leadless chip-carrier
See figure 1
CQCC1-N28
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage (VS):
V
V
CC (device types 01, 02, 03, 04).............................................
EE (device types 03, 04, 05, 06).............................................
+20 V dc
-20 V dc
Power dissipation (PD), TA = +25°C:
Device types 01, 02, 05, 06 .....................................................
Device types 03, 04 .................................................................
Storage temperature range .........................................................
Lead temperature (soldering, 10 seconds)..................................
Short circuit protection (to GND) .................................................
Thermal resistance:
300 mW
450 mW
-65°C to +150°C
+300°C
Continuous
Junction-to-case (θJC):
Case outlines C and 3..........................................................
Case outline X......................................................................
Case outline Y......................................................................
Junction-to-ambient (θJA):
See MIL-STD-1835
7°C/W
8°C/W
Case outline X......................................................................
Case outline Y......................................................................
30°C/W
25°C/W
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
2
DSCC FORM 2234
APR 97
SIPEX [ SIPEX CORPORATION ]
