Case outline X.
Symbol
Inches
Millimeters
Notes
Min
.215
.175
.016
.860
.490
.295
Max
.250
.215
.020
.885
.520
.305
Max
5.46
4.44
Min
6.35
5.46
A
A1
∅b
D
E
E1
e
0.41
0.51
7
3
3
6
4
21.84
12.45
7.49
22.48
13.21
7.75
.100 BSC
2.54 BSC
L
.130
.255
.290
.035
.160
.180
15°
3.30
3.81
0.51
2.54
2.03
0°
6.48
7.37
0.89
4.07
4.57
15°
L1
Q
S
S1
α
.150
.020
.100
.080
0°
2
5
NOTES:
1. Index area: A notch, square-package corner, or a pin one index point shall be located adjacent to pin one and
within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark.
2. Dimension Q shall be measured from the seating plane to the base plane.
3. This dimension allows for off-center lid, meniscus, and weld squash.
4. The basic pin spacing is .100 inch (2.54 mm) between centerlines. Each pin centerline shall be located within
±.010 inch (0.25 mm) of its exact longitudinal position relative to pins 1 and 14.
5. Dimension S1 is not used.
6. Lead center when α = 00. E1 shall be measured at the centerline of the leads (see MIL-STD-1835).
7. All leads: Increase maximum limit by .003 inch (0.08 mm) measured at the widest diameter when lead finish A or B
is applied.
8. If this configuration is used, no polymer or organic materials shall be applied or molded to the bottom of the
package or cover the leads.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
85030
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
H
7
DSCC FORM 2234
APR 97
SIPEX [ SIPEX CORPORATION ]
