SSF9435
DESCRIPTION
The SSF9435 uses advanced trench technology to
provide excellent R
DS(ON)
, low gate charge .It has been
optimized for power management applications requiring
a wide range of gave drive voltage ratings (4.5V – 25V).
G
D
S
Schematic diagram
GENERAL FEATURES
●
V
DS
= -30V,I
D
= -5.3A
R
DS(ON)
< 85mΩ @ V
GS
=-4.5V
R
DS(ON)
< 53mΩ @ V
GS
=-10V
●
High Power and current handing capability
●
Lead free product is acquired
●
Surface Mount Package
D
8
D D
7
D
6 5
9435
1
2
3 4
S S S G
Marking and pin Assignment
Application
●Battery
protection
●Load
switch
●Power
management
SOP-8
top view
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
9435
SSF9435
SOP-8
Ø330mm
Tape width
12mm
Quantity
3000 units
ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
Gate-Source Voltage
Drain Current-Continuous@ Current-Pulsed (Note 1)
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Limit
-30
±20
-5.3
-20
2.5
-55 To 150
Unit
V
V
A
A
W
℃
V
DS
V
GS
I
D
I
DM
P
D
T
J
,T
STG
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient (Note 2)
R
θJA
50
℃
/W
ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
ON CHARACTERISTICS (Note 3)
BV
DSS
I
DSS
I
GSS
V
GS
=0V I
D
=-250μA
V
DS
=-24V,V
GS
=0V
V
GS
=±20V,V
DS
=0V
Min
-30
Typ
Max
Unit
V
-1
±100
μA
nA
©Silikron Semiconductor CO.,LTD.
1
http://www.silikron.com
v1.1
SILIKRON [ SILIKRON SEMICONDUCTOR CO.,LTD. ]
