Si535/536
5. 6-Pin PCB Land Pattern
in the illustration.
Figure 4. Si535/536 PCB Land Pattern
Table 12. PCB Land Pattern Dimensions (mm)
Dimension
C1
E
X1
Y1
Min
4.20
2.54
1.55
1.95
Notes:
General
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3.
This Land Pattern Design is based on the IPC-7351 guidelines.
4.
All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based
on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
1.
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to
be 60 µm minimum, all the way around the pad.
Stencil Design
1.
A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
paste release.
2.
The stencil thickness should be 0.125 mm (5 mils).
3.
The ratio of stencil aperture to land pad size should be 1:1.
Card Assembly
1.
A No-Clean, Type-3 solder paste is recommended.
2.
The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
Preliminary Rev. 0.6
9
SILICONIMAGE [ Silicon image ]
