Si823x
5.5. Layout Considerations
It is most important to minimize ringing in the drive path and noise on the Si823x VDD lines. Care must be taken to
minimize parasitic inductance in these paths by locating the Si823x as close to the device it is driving as possible.
In addition, the VDD supply and ground trace paths must be kept short. For this reason, the use of power and
ground planes is highly recommended. A split ground plane system having separate ground and VDD planes for
power devices and small signal components provides the best overall noise performance.
5.6. Device Operation
Device behavior during start-up, normal operation and shutdown is shown in Figure 35, where UVLO+ and UVLO-
are the positive-going and negative-going thresholds respectively. Note that outputs VOA and VOB default low
when input side power supply (VDDI) is not present.
5.6.1. Device Startup
Outputs VOA and VOB are held low during power-up until VDD is above the UVLO threshold for time period
tSTART. Following this, the outputs follow the states of inputs VIA and VIB.
5.6.2. Under Voltage Lockout
Under Voltage Lockout (UVLO) is provided to prevent erroneous operation during device startup and shutdown or
when VDD is below its specified operating circuits range. The input (control) side, Driver A and Driver B, each have
their own under voltage lockout monitors.
The Si823x input side enters UVLO when VDDI < VDDI
, and exits UVLO when VDDI > VDDI
. The driver
UV+
UV–
outputs, VOA and VOB, remain low when the input side of the Si823x is in UVLO and their respective VDD supply
(VDDA, VDDB) is within tolerance. Each driver output can enter or exit UVLO independently. For example, VOA
unconditionally enters UVLO when VDDA falls below VDDA
and exits UVLO when VDDA rises above
UV–
VDDA
.
UV+
UVLO+
VDDHYS
UVLO-
VDDI
UVLO+
UVLO-
VDDHYS
VDDA
VIA
DISABLE
tSD
tRESTART
tPHL
tPLH
tSD
tSTART
tSTART
tSTART
VOA
Figure 35. Device Behavior during Normal Operation and Shutdown
24
Rev. 0.3
SILICON [ SILICON ]
