Si510/511
Table 9. Thermal Characteristics
Parameter
Symbol
Test Condition
Still air
Value
110
Unit
°C/W
°C/W
CLCC, Thermal Resistance Junction to Ambient
JA
2.5x3.2mm, Thermal Resistance Junction to Ambient
Still air
164
JA
Table 10. Absolute Maximum Ratings1
Parameter
Symbol
Rating
85
Unit
o
Maximum Operating Temperature
T
C
AMAX
o
Storage Temperature
T
–55 to +125
–0.5 to +3.8
C
S
Supply Voltage
V
V
V
DD
Input Voltage (any input pin)
ESD Sensitivity (HBM, per JESD22-A114)
V
–0.5 to V + 0.3
I
DD
HBM
2
kV
2
o
Soldering Temperature (Pb-free profile)
T
260
C
PEAK
2
Soldering Temperature Time at T
(Pb-free profile)
T
20–40
sec
PEAK
P
Notes:
1. Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation or
specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended
periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020E.
10
Rev. 1.4
SILICON [ SILICON ]
