SE103 参数 Datasheet PDF下载

SE1030W

LightCharger

™

2.5 Gb/s Transimpedance Amplifier

Final

Applications Information

Note that all VCC pads (1, 8, 11) are connected on-chip, as are the VEE1 pads (5, 6, 7), and only one pad of each

type is required to be bonded out. However, in order to minimize inductance for optimum high speed performance, it

is recommended that all power pads are wire bonded. The VEE2 pad is not connected on chip to VEE1 and must be

bonded out separately.

+3.3 V

PIN Bias

1 nF min

1

8

VCC

11

1 nF min

3

PIN

TZ Amplifier

SE1030W

TZ_IN

VEE2

4

5

VEE1

6

7

OUTP

10

OUTN 9

To 50 O loads,

AC coupled

0V

43-DST-01

§

Rev 1.5

§

May 24/02

8 of 9