SUD50N04-07
N-Channel
40 V (D-S) 175 °C MOSFET
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Symbol
V
(BR)DSS
V
GS(th)
I
GSS
I
DSS
I
D(on)
Test Conditions
V
GS
= 0 V, I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 32 V, V
GS
= 0 V
V
DS
= 32 V, V
GS
= 0 V, T
J
= 125 °C
V
DS
= 32 V, V
GS
= 0 V, T
J
= 175 °C
V
DS
= 5 V, V
GS
= 10 V
V
GS
= 10 V, I
D
= 20 A
V
GS
= 10 V, I
D
= 20 A, T
J
= 125 °C
V
GS
= 10 V, I
D
= 20 A, T
J
= 175 °C
V
GS
= 4.5 V, I
D
= 10 A
Min
40
1
Typ
Max
Unit
3
± 100
1
50
150
V
nA
µA
A
65
0.006
0.0074
0.012
0.015
0.0085
20
57
2800
0.011
Drain-Source On-State Resistance
a
r
DS(on)
Ω
Forward Transconductance
Dynamic
b
Input Capacitance
Output Capacitance
a
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
V
DS
= 15 V, I
D
= 15 A
S
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz
320
190
50
75
pF
Reverse Transfer Capacitance
Total Gate
Charge
c
Charge
c
c
Gate-Source
V
DS
= 20 V, V
GS
= 10 V, I
D
= 50 A
10
10
2.0
11
20
30
60
25
43
100
nC
Ω
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise
Time
c
Turn-Off DelayTime
Fall Time
c
Continous Current
Pulsed Current
Forward Voltage
a
c
t
d(on)
t
r
t
d(off)
t
f
b
c
V
DD
= 20 V, R
L
= 0.4
Ω
I
D
≅
50 A, V
GEN
= 10 V, R
g
= 2.5
Ω
20
40
15
ns
Source-Drain Diode Ratings and Characteristics (T
C
= 25 °C)
I
S
I
SM
V
SD
t
rr
A
V
ns
I
F
= 30 A, V
GS
= 0 V
I
F
= 30 A, di/dt = 100 A/µs
0.90
30
1.50
45
Reverse Recovery Time
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2/6
www.freescale.net.cn