SQ1912EEH
Automotive Dual N-Channel
20 V (D-S) 175 °C MOSFET
Dual-Channel LITTLE FOOTR 6-Pin SC-70 MOSFET
Copper Leadframe Version
Recommended Pad Pattern and Thermal Performance
INTRODUCTION
26 (mil)
87 (mil)
The new dual 6-pin SC-70 package with a copper leadframe
enables improved on-resistance values and enhanced
thermal performance as compared to the existing 3-pin and
6-pin packages with Alloy 42 leadframes. These devices are
intended for small to medium load applications where a
miniaturized package is required. Devices in this package
come in a range of on-resistance values, in n-channel and
p-channel versions. This technical note discusses pin-outs,
package outlines, pad patterns, evaluation board layout, and
thermal performance for the dual-channel version.
6
5
4
96 (mil)
71 (mil)
48 (mil)
23 (mil)
1
2
3
61 (mil)
PIN-OUT
Figure 1 shows the pin-out description and Pin 1 identification
for the dual-channel SC-70 device in the 6-pin configuration.
Both n-and p-channel devices are available in this package –
the drawing example below illustrates the p-channel device.
SOT-363
SC-70 (6-LEADS)
S
1
G
1
D
2
1
6
5
D
1
G
2
S
2
0.0 (mil)
8 (mil)
26 (mil)
16 (mil)
FIGURE 2.
SC-70 (6 leads) Dual
EVALUATION BOARD FOR THE DUAL-
CHANNEL SC70-6
The 6-pin SC-70 evaluation board (EVB) shown in Figure 3
measures 0.6 in. by 0.5 in. The copper pad traces are the same
as described in the previous section,
Basic Pad Patterns.
The
board allows for examination from the outer pins to the 6-pin
DIP connections, permitting test sockets to be used in
evaluation testing.
The thermal performance of the dual 6-pin SC-70 has been
measured on the EVB, comparing both the copper and Alloy
42 leadframes. This test was then repeated using the 1-inch
2
PCB with dual-side copper coating.
A helpful way of displaying the thermal performance of the
6-pin SC-70 dual copper leadframe is to compare it to the
traditional Alloy 42 version.
2
3
4
Top View
FIGURE 1.
For package dimensions see outline drawing SC-70 (6-Leads)
(http://www.vishay.com/doc?71154)
BASIC PAD PATTERNS
See Application Note 826,
Recommended Minimum Pad
Patterns With Outline Drawing Access for Vishay Siliconix
MOSFETs,
(http://www.vishay.com/doc?72286) for the SC-70
6-pin basic pad layout and dimensions. This pad pattern is
sufficient for the low-power applications for which this package
is intended. Increasing the drain pad pattern (Figure 2) yields
a reduction in thermal resistance and is a preferred footprint.
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