DG996049
MODEL No.
Jud16i99
PAGE
GL6ZR27
1
S/10
4. Reliability
The reliability of productsshagbe satisfiedwith itemslistedbelow.
4- 1. Test itemsand testconditions
Test items
Solderability
Soldering
temperature
Mechanicalshock
Variable frequency
vibration
Terminal strength
(Tension)
Terminal strength
(Bending)
Temperature
cycling
High temp*andhigh
humidity storage
I
230f5=C, 5s
Prior diisition
260+5”c, 5s
15OOO&, 0.5ms.
3times/ kXSY$Z direction
2OOm/s*, to 2 0OO lOOHz/sweep 4min.
100
to
for
,4times/fX~Y,fZ direction
Weight:lON, Ss/each terminal
Weight:SN, 0” ---*90” -B O”* -90” + 0”
/each terminal
-40”c(3Or11in)~+l0O”c(3Omin),30cycles
Test conditions
: Dip in rosin flux
Confidencelevel: 90%
LTPD
Samples
(n)
Defective (C)
(Q/g)
rl=ll,C=O
n=ll,C=O
n=ll, C=O
n=ll, C=O
n=ll,C=0
n=ll. C=O
20
20
20
20
20
20
10
10
10
I
I
10
10
I
I
I
I
I
n=22, C=O
n=22, C=O
n=22, C=O
n=22. C=O
n=22, C=O
I
I
Ta=+60”C. 9O%RH, t=lO0Oh
I-l temperature
tigh
storage
Ta=10O”C,t=lOOOh
Low temperature
storageTa=-40”C, t=lO0Oh
I
Operationlife
Ta=25”C, &MAX, t=lOO0h *3
I
4-2. Measurement
itemsand Failurejudgementcriteria * 1
Measurement
Forward voltage
Reversecurrent
I+rninous intensity
SjTIlbOl
VF
IR
Failurejudgementcriteria *2
v, > U.S.L. x 1.2
IR > U.S.L. x 2.0
Iv > The first stagevalue X 2.0 or The first stagevalue X 0.5 > Iv
IV
z Solderability : Soldershallbe adhereat the areaof 95% or moreof dippedportion.
s Terminal strength: Packageis not destroyed, and termi.naiis not slack.
* 1: Measuringcondition is in accordance
with specification.
*2: U.S.L. is shownby Upper Specification Limit.
*3: IF MAX.is shownby forward current of absolutemaximumratings.
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
