5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
• Preliminary heating to be at 150℃max. for 2 minutes max.
• Soldering heat to be at 240℃max. for 5 seconds max.
°C
Operation heating
240
Temperature
150
Cooling:
-5°C/sec.
Pre-heating
rise: 5°C/sec.
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
• Preliminary heating to be at 150℃max. for 2 minutes max.
• Soldering heat to be at 260℃max. for 10 seconds max.
°C
Operation heating
260
Temperature
150
Cooling:
-5°C/sec.
Pre-heating
rise: 5°C/sec.[Max]
120
0
60 to 120 sec.
10 sec.
(3) Hand Soldering Condition
• Not more than 1 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, Seoul Semiconductor can not guarantee the
performance of the products.
Rev. 00
September 2009
www.acriche.com
SEOUL [ Seoul Semiconductor ]
