CF5072AA-1 参数 Datasheet PDF下载

CF5072 series

PAD LAYOUT

(Unit: µm)

(1820,1000)

7

6

5

4

3

VDD1

OUTN

OUT

VDD2

XIN

XC

Y

NC

XR

VC

VSS1

(0,0)

X

9

10

11

12

13

1

8

2

TEST

Chip size: 1.82

×

1.00mm

Chip thickness: 300 ± 30µm

Pad size: 110

×

100µm (TEST pin only = 90

×

90µm)

Chip base: V

SS

potential

PAD DESCRIPTION AND DIMENSIONS

Pad No.

1

2

3

4

5

6

7

8

9

10

11

Name

VSS1

TEST

OE

VSS2

OUT

OUTN

VDD1

VDD2

XIN

XC

NC

I/O

–

I

Function

ina

Pad dimensions [µm]

X

Y

125

135

1283

1695

1695

1695

1695

1695

643

125

125

125

125

125

160

135

268

460

673

865

865

828

708

495

375

255

ry

VSS2

OE

DA5072

Pad size [µm]

X

110

90

110

110

110

110

110

100

110

110

110

110

110

Y

100

90

100

100

100

100

100

110

100

100

100

100

100

pre

–

I

No connection

12

XR

1

VC

13

I

Control voltage pin

1. The XR pin electrostatic withstand voltage is weaker than the other pins. The electrostatic withstand voltage of pins, excluding XR, is the same as that

for existing NPC devices.

lim

I

Output enable, with pull-up resistor built-in

–

Ground

O

O

–

–

I

ECL buffer supply

Supply

Crystal unit connection

I

Varicap anode connection

Oscillator ground

IC test pin (leave open circuit for normal operation)

Differential PECL non-inverting output (true)

Differential PECL inverting output (complementary)

Varicap cathode connection and inductor connection

NIPPON PRECISION CIRCUITS INC.—3