SM5009 series
PAD LAYOUT
(Unit:
µ
m)
PINOUT
(Top view)
VDD
Q
(920,1220)
Y
INHN
XT
XTN
1
2
3
4
8
7
6
5
VDD
NC
NC
Q
(0,0)
INHN XT XTN VSS
X
Chip size: 0.92
×
1.22mm
Chip thickness: 300 ± 30µm
Chip base: V
DD
level
PIN DESCRIPTION and PAD DIMENSIONS
Pad dimensions [µm]
Number
Name
I/O
Description
X
1
2
3
4
5
6
7
8
INHN
XT
XTN
VSS
Q
NC
NC
VDD
I
I
O
–
O
–
–
–
Output state control input. Standby mode when LOW, pull-up resistor built-in.
In the case of the CF5009AL
×
, the oscillator stops and power-saving pull-up
resistor built in to reduce current consumption at standby mode.
Amplifier input.
Amplifier output.
Ground
Output. Output frequency (f
O
, f
O
/2, f
O
/4, f
O
/8, f
O
/16, f
O
/32) determined by
internal connection
No connection
No connection
Supply voltage
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XTN
195
385
575
766
765
–
–
162
Y
212
212
212
212
1062
–
–
1062
HA5009
VSS
SEIKO NPC CORPORATION —2
SEIKO [ SEIKO EPSON CORPORATION ]
