STK433-070-E
Evaluation Board Characteristics
THD - P
Pd - P
O
O
100
100
90
80
70
60
50
40
30
20
10
7
V
= 29V
V
= 29V
CC
CC
5
VG=30dB
Rg=600Ω
Tc=25°C
VG=30dB
f=1kHz
3
2
10
Rg=600Ω
Tc=25°C
7
5
R =6Ω
L
3
2
2ch Drive
R =6Ω
L
1.0
2ch Drive
7
5
3
2
0.1
7
5
f=2
0kH
z
3
2
0.01
7
5
3
2
0.001
0.1
0
0.1
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5
7
2
3
5 7
100
1.0
10
100
1.0
10
Output power, P /ch - W
Output power, P /ch - W
ITF02678
O
ITF02679
O
P
- f
P
O
- V
O
CC
100
90
80
70
60
50
40
30
20
100
90
80
70
60
50
40
30
20
VG=30dB
Rg=600Ω
R =6Ω
L
Tc=25°C
f=1kHz
THD=10%
2ch Drive
%
=0.4
THD
V
= 29V
CC
VG=30dB
Rg=600Ω
Tc=25°C
10
0
10
0
R =6Ω
L
2ch Drive
2
3
5 7
2
3
5 7
2
3
5 7
2
3
5 7
100k
10
15
20
25
30
35
40
10
100
1k
10k
Supply voltage, V
CC
-
V
Frequency, f - Hz
ITF02680
ITF02681
[Thermal Design Example for STK433-070-E (R = 6Ω)]
L
The thermal resistance, θc-a, of the heat sink for total power dissipation, Pd, within the hybrid IC is determined as
follows.
Condition 1: The hybrid IC substrate temperature, Tc, must not exceed 125°C.
Pd × θc-a + Ta < 125°C ................................................................................................. (1)
Ta: Guaranteed ambient temperature for the end product
Condition 2: The junction temperature, Tj, of each power transistor must not exceed 150°C.
Pd × θc-a + Pd/N × θj-c + Ta < 150°C .......................................................................... (2)
N: Number of power transistors
θj-c: Thermal resistance per power transistor
However, the power dissipation, Pd, for the power transistors shall be allocated equally among the number of power
transistors.
The following inequalities result from solving equations (1) and (2) for θc-a.
θc-a < (125 − Ta)/Pd ...................................................................................................... (1)'
θc-a < (150 − Ta)/Pd − θj-c/N ........................................................................................ (2)'
Values that satisfy these two inequalities at the same time represent the required heat sink thermal resistance.
When the following specifications have been stipulated, the required heat sink thermal resistance can be determined
from formulas (1)' and (2)' .
• Supply voltage
• Load resistance
• Guaranteed ambient temperature
V
R
Ta
CC
L
No. A1488-7/11
SANYO [ SANYO SEMICON DEVICE ]
