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K9F1216U0A-DIB00 参数 Datasheet PDF下载

K9F1216U0A-DIB00图片预览
型号: K9F1216U0A-DIB00
PDF下载: 下载PDF文件 查看货源
内容描述: [Flash, 32MX16, 30ns, PBGA63, TBGA-63]
分类和应用: 内存集成电路
文件页数/大小: 47 页 / 822 K
品牌: SAMSUNG [ SAMSUNG ]
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K9F1208Q0A K9F1216Q0A  
K9F1208D0A K9F1216D0A  
K9F1208U0A K9F1216U0A  
FLASH MEMORY  
Document Title  
64M x 8 Bit , 32M x 16 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial issue.  
Apr. 25th 2002  
Preliminary  
0.1  
TBGA(K9F12XXX0A-DCB0/DIB0) size information is changed.  
(before) 9 x 11 /0.8mm pitch , Width 1.0 mm  
(after ) To Be Decided.  
May. 9th 2002  
0.2  
TBGA(K9F12XXX0A-DCB0/DIB0) size information is changed.  
(before) 9 x 11 /0.8mm pitch , Width 1.0 mm, to  
(after) 8.5 x 15 /0.8mm pitch, Width 1.0mm  
July, 10th 2002  
0.3  
0.4  
Pin numbering includes TBGA Dummy ball . (Page5)  
Aug, 10th 2002  
Oct, 21th 2002  
Pin numbering excludes TBGA Dummy ball . (Page5)  
Pin assignment of TBGA dummy ball is changed.  
(before) DNU --> (after) N.C  
0.5  
1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 43)  
2. Add the data protection Vcc guidence for 1.8V device - below about  
1.1V. (Page 44)  
Nov, 21th 2002  
0.6  
0.7  
The min. Vcc value 1.8V devices is changed.  
K9F12XXQ0A : Vcc 1.65V~1.95V --> 1.70V~1.95V  
Mar. 5th 2003  
Mar. 13rd 2003  
Pb-free Package is added.  
K9F1208U0A-FCB0,FIB0  
K9F1208Q0A-HCB0,HIB0  
K9F1216U0A-HCB0,HIB0  
K9F1216U0A-PCB0,PIB0  
K9F1216Q0A-HCB0,HIB0  
K9F1208U0A-HCB0,HIB0  
K9F1208U0A-PCB0,PIB0  
0.8  
Errata is added.(Front Page)-K9F12XXQ0A  
tWC tWH tWP tRC tREH tRP tREA tCEA  
Mar. 17th 2003  
Specification  
45 15 25 50 15 25 30  
45  
55  
Relaxed value 60 20 40 60 20 40 40  
New definition of the number of invalid blocks is added.  
(Minimum 1004 valid blocks are guaranteed for each contiguous 128Mb  
memory space.)  
0.9  
1.0  
Apr. 4th 2003  
Jul. 4th 2003  
1. 2.65V device is added.  
2. Note is added.  
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for  
durations of 20 ns or less.)  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
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