[SML-D14DWT86(C)]
[Data Sheet]
ꢀꢀꢀꢀ
4.Mounting
4-1. Soldering
・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion
and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence
on the product’s reliability.
・The product is not guaranteed for flow soldering.
・Thermal stress during the flow soldering of surrounding parts will influence the reliability of LED and please
evaluate the soldering conditions before using it. Also please make sure the expiration date after opening the
moistureproof package.
・Please set appropriate reflow temperature based on our product usage conditions and specification.
・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts
within the usage limitation after open the moistureproof package.
・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the
discoloration of the resin.
・For our product that has no solder resist, because of its solder amount and soldering conditions, one of its
specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its
reliability. Therefore, please be informed, concerning it before using it.
4-2. Automatic Mounting
4-2-1.Suction nozzle
Excessive load may cause damage inside the LED product, so select an optimal suction nozzle according to the
material and shape of the LED product.
4-2-2.Mini Package (Smaller than 1608 size)
Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover
tape. We recommend to
・set magnet on parts feeder cassette of the mounter to control the product stabilization
・set ionizer to prevent electrostatic charge
4-3. Mounting Location
The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage
of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or
screwing with great stress of the circuit board.
Stress strength according to
the mounting position:
A＞B＞C＞D
4-4. Mechanical Stress after Mounting
The mechanical stress may damage the LED after circuit mounting, so please pay attention to the touch on product.
4-5. Soldering Pattern for Recommendation
We recommend the soldering pattern that shows on the right.
It will be different according to mounting situation of circuit board,
therefore, please concern before designing.
※The product has adopted the electrode structure that it should solder
with back electrode of the product.
Thus, please be informed that the shape of electrode pin of
solder fillet formation is not guaranteed.
The through hole on electrode surface is for conduction of front
and rear electrodes but not for formation of solder fillet.
(Unit：mm)
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9/15
2023.3 - Rev.001
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