LM358DT/PT/ST/WDT/WPT,LM2904DT/PT/ST/WDT/WPT
LM324DT/PT/WDT,LM2902DT/PT/WDT
Technical Note
●Derating curves
800
1000
800
600
400
200
0
LM358PT
LM358WPT
LM2904PT
LM2904WPT
LM2902ST
LM358ST
600
400
200
0
LM2904ST
LM2902DT
LM2902WDT
LM2904DT
LM2904WDT
LM324PT
LM358DT
LM358WDT
LM324DT
LM324WDT
70
75
70
75
0
25
50
100
125
150
0
25
50
100
125
150
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
LM358DR/PWR/DGKR
LM324DR/PWR/KDR
LM2904DR/PWR/DGKR/VQDR/VQPWR
LM2902DR/PWR/KDR/KPWR/KQDR/KQPWR
Power Dissipation
Power Dissipation
Package
Pd[W]
450
θja [℃/W]
Package
Pd[W]
610
θja [℃/W]
4.9
3.6
4.0
SO package14
TSSOP14
SO package8 (*8)
TSSOP8 (*6)
500
870
7.0
470
3.76
Mini SO8 (*7)
Fig.102 Derating Curves
●Precautions
1) Unused circuits
Vcc+
When there are unused circuits, it is recommended that they be connected as in Fig.103, setting
the non-inverting input terminal to a potential within the in-phase input voltage range (VICM).
2) Input terminal voltage
Applying Vcc- + 32V to the input terminal is possible without causing deterioration of the electrical
characteristics or destruction, irrespective of
－
＋
connect
to Vicm
the supply voltage. However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is
within the common mode input voltage range of the electric characteristics.
Vcc-
3) Power supply (single / dual)
The op-amp operates when the voltage supplied is between Vcc+ and Vcc-.
Therefore, the single supply op-mp can be used as a dual supply op-amp as well.
Fig.103 Disable circuit example
4) Power dissipation (Pd)
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise in chip temperature, including
reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient
margin in thermal design. Refer to the thermal derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Incorrect mounting may damage the IC. In addition, the presence of foreign substances between the outputs, the output and the power supply, or the output
and Vcc- may result in IC destruction.
6) Operation in a strong electromagnetic field
Operation in a strong electromagnetic field may cause malfunctions.
7) Radiation
This IC is not designed to withstand radiation.
8) IC handing
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuation of the electrical characteristics due to piezoelectric (piezo)
effects.
9) IC operation
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected to the middle potential of Vcc+ and
Vcc-, crossover distortion occurs at the changeover between discharging and charging of the output current. Connecting a resistor between the output
terminal and Vcc-, and increasing the bias current for Class A operation will suppress crossover distortion.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition,
when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please
take measures against ESD in the assembly process as well as during transportation and storage.
11) Output capacitor
Discharge of the external output capacitor to Vcc+ is possible via internal parasitic elements when Vcc+ is shorted to Vcc-, causing damage to the internal
circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage
comparators, use an output capacitor with a capacitance less than 0.1μF.
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