BM6112FV-C
Thermal Resistance (Note 4)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 6)
2s2p(Note 7)
SSOP-B28W
Junction to Ambient
Junction to Top Characterization Parameter(Note 5)
θJA
112.9
34
64.4
23
°C/W
°C/W
ΨJT
(Note 4) Based on JESD51-2A(Still-Air)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 6) Using a PCB board based on JESD51-3.
(Note 7) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
Recommended Operating Conditions
Parameter
Input-side Supply Voltage
Symbol
Min
4.5
14
Max
5.5
20
Unit
V
(Note 8)
VCC1
(Note 9)
Output-side Positive Supply Voltage
Output-side Negative Supply Voltage
VCC2
V
(Note 9)
VEE2
-12
0
V
Maximum Difference between Output-side Positive and Negative
Supply Voltages
VMAX2
Topr
-
28
V
Operating Temperature
-40
+125
°C
(Note 8) Relative to GND1
(Note 9) Relative to GND2
Insulation Related Characteristics
Parameter
Symbol
RS
Characteristic
>109
Unit
Ω
Insulation Resistance (VIO = 500 V)
Insulation Withstand Voltage / 1 min
Insulation Test Voltage / 1 s
VISO
3750
Vrms
Vrms
VISO
4500
www.rohm.com
TSZ02201-0818ACH00110-1-2
18.Nov.2019 Rev.001
© 2019 ROHM Co., Ltd. All rights reserved.
5/35
TSZ22111 • 15 • 001
ROHM [ ROHM ]
