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BM6112FV-C 参数 Datasheet PDF下载

BM6112FV-C图片预览
型号: BM6112FV-C
PDF下载: 下载PDF文件 查看货源
内容描述: [BM6112FV-C is a gate driver with isolation voltage of 3750Vrms, I/O delay time of 150ns, and incorporates fault signal output function, ready signal output function, under voltage lockout (UVLO) function, short circuit protection (SCP) function, active miller clamping function, output state feedback function and temperature monitor function.For sale of this product, please contact the specifications in our sales office. Currently, we don't sell this on the internet distributors now.]
分类和应用:
文件页数/大小: 38 页 / 2989 K
品牌: ROHM [ ROHM ]
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BM6112FV-C  
Block Diagram  
Absolute Maximum Ratings  
Parameter  
Symbol  
VCC1MAX  
VCC2MAX  
VEE2MAX  
Rating  
Unit  
V
Input-side Supply Voltage  
-0.3 to +7.0(Note 2)  
-0.3 to +24.0(Note 3)  
-15.0 to +0.3(Note 3)  
Output-side Positive Supply Voltage  
Output-side Negative Supply Voltage  
V
V
Maximum Difference between Output-side Positive and  
Negative Supply Voltages  
VMAX2  
30.0  
V
INA, INB, ENA Pin Input Voltage  
FLT, RDY Pin Input Voltage  
FLT, RDY Pin Output Current  
SENSOR Pin Output Current  
SCPIN1, SCPIN2 Pin Input Voltage  
TO Pin Input Voltage  
VINMAX  
VFLTMAX,VRDYMAX  
IFLT,IRDY  
ISENSOR  
-0.3 to VCC1+0.3 or +7.0(Note 2)  
V
V
-0.3 to +7.0(Note 2)  
10  
mA  
mA  
V
10  
VSCPINMAX  
VTOMAX  
-0.3 to VCC2+0.3 or +24.0(Note 3)  
-0.3 to VCC2+0.3 or +24.0(Note 3)  
V
TO Pin Output Current  
ITOMAX  
1
mA  
°C  
°C  
Storage Temperature Range  
Maximum Junction Temperature  
Tstg  
-55 to +150  
+150  
Tjmax  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing  
board size and copper area so as not to exceed the maximum junction temperature rating.  
(Note 2) Relative to GND1  
(Note 3) Relative to GND2  
www.rohm.com  
TSZ02201-0818ACH00110-1-2  
18.Nov.2019 Rev.001  
© 2019 ROHM Co., Ltd. All rights reserved.  
4/35  
TSZ22111 15 001  
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