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BM28723AMUV 参数 Datasheet PDF下载

BM28723AMUV图片预览
型号: BM28723AMUV
PDF下载: 下载PDF文件 查看货源
内容描述: [BM1050AF是组合了应对高次谐波的功率因数校正(Power Factor Correction)转换器(以下简称PFC部)与DC/DC转换器(以下简称DC/DC部)的复合LSI。DC/DC部采用准谐振方式动作,有助于实现低EMI。BM1050AF内置650V耐压启动电路。PFC部、DC/DC部均外接开关MOSFET及电流检测电阻,可实现自由度高的电源设计。PFC部采用峰值电流控制。利用带AC电压过低补偿电路的乘法器、应对负载变动的电路、最大功率补偿电路等各种保护电路,提供合适的应用方案。此外,内置跳频功能,有助于实现低EMI。DC/DC部的准谐振方式为软开关动作,有助于实现低EMI。内置脉冲串模式,可降低轻负载时的功耗。内置了软启动功能、脉冲串功能、逐周期过电流限制、过电压保护、过负荷保护等各种保护功能。与微控制器间设有通信控制用端子、外部停止端子,可提供适用于各种应用的系统方案。]
分类和应用: 通信开关控制器微控制器软启动脉冲功率因数校正转换器
文件页数/大小: 82 页 / 5460 K
品牌: ROHM [ ROHM ]
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BM28723AMUV  
Operational Notes  
1. Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the LSI. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the LSI’s power  
supply pins.  
2. Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the  
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog  
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and  
aging on the capacitance value when using electrolytic capacitors.  
3. Ground Voltage  
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,  
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground  
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below  
ground will not cause the LSI and the system to malfunction by examining carefully all relevant factors and conditions  
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.  
4. Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5. Recommended Operating Conditions  
These conditions represent a range within which the expected characteristics of the LSI can be approximately obtained.  
The electrical characteristics are guaranteed under the conditions of each parameter.  
6. Inrush Current  
When power is first supplied to the LSI, it is possible that the internal logic may be unstable and inrush current may  
flow instantaneously due to the internal powering sequence and delays, especially if the LSI has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and  
routing of connections.  
7. Testing on Application Boards  
When testing the LSI on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the LSI to stress. Always discharge capacitors completely after each process or step. The LSI’s power supply  
should always be turned OFF completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the LSI during assembly and use similar precautions during  
transport and storage.  
www.rohm.com  
TSZ02201-0C1C0E900720-1-2  
© 2018 ROHM Co., Ltd. All rights reserved.  
75/79  
TSZ22111 15 001  
31.Aug.2018 Rev.001  
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