BM28723AMUV
Thermal Resistance(Note 6)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 8)
2s2p(Note 9)
VQFN032V5050
Junction to Ambient
Junction to Top Characterization Parameter(Note 7)
θJA
138.9
11
39.1
5
°C/W
°C/W
ΨJT
(Note 6) Based on JESD51-2A (Still-Air)
(Note 7) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 8) Using a PCB board based on JESD51-3.
(Note 9) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Thermal Via(Note 10)
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20mm
Φ0.30mm
Top
Copper Pattern
Bottom
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
70μm
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
(Note 10) This thermal via connects with the copper pattern of all layers.
Recommended Operating Conditions (Ta=-25°C to +85°C)
Parameter
Supply voltage
Symbol
VCCP1
VCCP2
Limit
10 to 24
10 to 24
Unit
V
V
Conditions
Pin 24(Note 1) (Note 2)
Pin 17(Note 1) (Note 2)
VDVDD
Pin 10 (Note 1)
3.0 to 3.6
6.4
V
Ω
Ω
Ω
21V<VCCP1, VCCP2≤24V(Note 2)
14V<VCCP1, VCCP2≤21V(Note 2)
VCCP1, VCCP2≤14V(Note 2)
Minimum load impedance
RL
4.8
3.6
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TSZ02201-0C1C0E900720-1-2
31.Aug.2018 Rev.001
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