MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A
PACKAGE DIMENSIONS
WQFN10
CASE 510AJ
ISSUE A
NOTES:
L
L
D
B
E
A
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
PIN ONE
REFERENCE
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
MILLIMETERS
DIM
A
MIN
0.70
0.00
0.20 REF
0.20
MAX
0.80
0.05
0.15
C
A1
A3
b
EXPOSED Cu
MOLD CMPD
0.15
C
TOP VIEW
0.30
D
2.60 BSC
E
2.60 BSC
0.50 BSC
A3
DETAIL B
e
0.10
0.08
C
C
DETAIL B
L
0.45
0.00
0.55
0.55
0.15
0.65
ALTERNATE
L1
L2
A
CONSTRUCTIONS
A1
NOTE 4
SEATING
PLANE
SOLDERING FOOTPRINT*
C
SIDE VIEW
2.90
DETAIL A
5
9X
L
1
0.50
PITCH
2.90
4
1
6
9
10X
0.30
e
10X
0.73
10
L2
DIMENSIONS: MILLIMETERS
10X b
0.10
C
A
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
0.05
C
BOTTOM VIEW
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25
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