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MC33072DR2G 参数 Datasheet PDF下载

MC33072DR2G图片预览
型号: MC33072DR2G
PDF下载: 下载PDF文件 查看货源
内容描述: [DUAL OP-AMP, 7000 uV OFFSET-MAX, 4.5 MHz BAND WIDTH, PDSO8, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOIC-8]
分类和应用: 放大器PC光电二极管
文件页数/大小: 26 页 / 951 K
品牌: ROCHESTER [ Rochester Electronics ]
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MC34071,2,4,A MC33071,2,4,A, NCV33072,4,A  
PACKAGE DIMENSIONS  
TSSOP14  
CASE 948G  
ISSUE B  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
M
S
S
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
V
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
DETAIL E  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T  
U
A
V−  
MILLIMETERS  
INCHES  
K1  
DIM MIN  
MAX  
MIN MAX  
A
B
C
D
F
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
1.20  
0.15 0.002 0.006  
0.75 0.020 0.030  
J J1  
−−− 0.047  
SECTION NN  
G
H
J
J1  
K
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
W−  
C
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
0 ꢁ  
8 ꢁ  
0 ꢁ  
8 ꢁ  
SEATING  
PLANE  
T−  
H
G
DETAIL E  
D
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
22  
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