Package TSLP-4-4
BAS16...
Package Outline
Top view
Bottom view
0.4+0.01
±0.05
0.8
1)
±0.035
4x0.25
0.05 MAX.
2
3
3
2
4
1
1
4
±0.05
0.45
Pin 1 marking
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.8
0.78
0.28
0.3
0.28
0.3
0.22
0.2
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BAR90-07L4
Type code
Pin 1 marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
4
Pin 1
1.05
marking
2007-07-26
20