Package TSLP-2-1
BAS16...
Package Outline
Top view
Bottom view
0.4+0.1
±0.05
0.6
0.05 MAX.
2
2
1
1
1)
±0.035
0.5
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
Copper
Solder mask
Stencil apertures
Marking Layout (Example)
BAS16-02L
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
0.5
4
Cathode
marking
0.76
2007-07-26
19