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ADSP-BF532SBBCZ400 参数 Datasheet PDF下载

ADSP-BF532SBBCZ400图片预览
型号: ADSP-BF532SBBCZ400
PDF下载: 下载PDF文件 查看货源
内容描述: [16-BIT, 40 MHz, OTHER DSP, PBGA160, ROHS COMPLIANT, MO-205AE, CSBGA-160]
分类和应用: 时钟外围集成电路
文件页数/大小: 65 页 / 5323 K
品牌: ROCHESTER [ Rochester Electronics ]
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ADSP-BF531/ADSP-BF532/ADSP-BF533  
Table 37. Thermal Characteristics for BC-160 Package  
Parameter Condition Typical Unit  
THERMAL CHARACTERISTICS  
To determine the junction temperature on the application  
printed circuit board, use:  
JA  
0 Linear m/s Airflow  
27.1  
23.85  
22.7  
7.26  
0.14  
0.26  
0.35  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
TJ = TCASE + JT PD  
JMA  
JMA  
JC  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
where:  
TJ = Junction temperature (°C).  
T
CASE = Case temperature (°C) measured by customer at top  
JT  
JT  
JT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
center of package.  
JT = From Table 37 through Table 39.  
PD = Power dissipation (see the power dissipation discussion  
and the tables on 24 for the method to calculate PD).  
Values of JA are provided for package comparison and printed  
circuit board design considerations. JA can be used for a first  
order approximation of TJ by the equation:  
Table 38. Thermal Characteristics for ST-176-1 Package  
Parameter Condition Typical Unit  
JA  
0 Linear m/s Airflow  
34.9  
33.0  
32.0  
0.50  
0.75  
1.00  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
TJ = TA + JA PD  
JMA  
JMA  
JT  
JT  
JT  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
where:  
TA = ambient temperature (°C).  
In Table 37 through Table 39, airflow measurements comply  
with JEDEC standards JESD51–2 and JESD51–6, and the junc-  
tion-to-board measurement complies with JESD51–8. The  
junction-to-case measurement complies with MIL-STD-883  
(Method 1012.1). All measurements use a 2S2P JEDEC test  
board.  
Table 39. Thermal Characteristics for B-169 Package  
Parameter Condition Typical Unit  
JA  
0 Linear m/s Airflow  
22.8  
20.3  
19.3  
10.39  
0.59  
0.88  
1.37  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal resistance JA in Table 37 through Table 39 is the figure  
of merit relating to performance of the package and board in a  
convective environment. JMA represents the thermal resistance  
under two conditions of airflow. JT represents the correlation  
JMA  
JMA  
JC  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Not Applicable  
between TJ and TCASE  
.
JT  
JT  
JT  
0 Linear m/s Airflow  
1 Linear m/s Airflow  
2 Linear m/s Airflow  
Rev. H  
| Page 50 of 64 | January 2011