PE-SON1612-6-0510
PACKAGE INFORMATION
Power Dissipation (SON1612-6)
This specification is at mounted on board.
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50%, Back side : Approx.50%
Through-hole
φ0.5mm × 24pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
500mW
Power Dissipation
Thermal Resistance
θja=(125−25°C)/0.5W=200°C/W
600
500
400
300
200
100
0
39
On Board
27
40
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.28 0.5
(Unit: mm)
RICOH [ RICOH ELECTRONICS DEVICES DIVISION ]
