PE-SOT-23-5-0610
PACKAGE INFORMATION
POWER DISSIPATION (SOT-23-5)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
(Power Dissipation (SOT-23-5) is substitution of SOT-23-6.)
Measurement Conditions
Standard Land Pattern
Environment
Board Material
Board Dimensions
Copper Ratio
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
40mm × 40mm × 1.6mm
Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ0.5mm × 44pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
420mW
Free Air
250mW
Power Dissipation
Thermal Resistance
θja=(125−25°C)/0.42W=263°C/W
400°C/W
600
40
500
On Board
420
400
Free Air
300
250
200
100
0
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.7 MAX.
1.0
2.4
0.95
1.9
0.95
(Unit: mm)
RICOH [ RICOH ELECTRONICS DEVICES DIVISION ]
