RT6541A
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
PGOOD
(upper side threshold decide by OV threshold)
Trip Threshold (falling)
Propagation Delay
Output Low Voltage
Leakage Current
Hys = 3%
Falling edge, with respect to PGOOD
threshold
I
SINK
= 1mA
High state, forced to 5.0V
0.625
--
--
--
0.675 0.725
3
--
--
--
0.4
1
V
s
V
A
Note 1.
Stresses beyond those listed under
“Absolute
Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Note 2.
θ
JA
is measured under natural convection (still air) at T
A
= 25°C with the component mounted on a high effective-
thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard.
θ
JC
is measured at the
exposed pad of the package.
Note 3.
Devices are ESD sensitive. Handling precaution is recommended.
Note 4.
The device is not guaranteed to function outside its operating conditions.
Copyright
©
2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
6
DS6541A-02
September 2019
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
