RT6263A/B
Parameter
Symbol
Test Conditions
Min Typ Max
Unit
Thermal Shutdown
Thermal Shutdown Threshold TSD
--
--
155
35
--
--
°C
Thermal Shutdown Hysteresis TSD
Power Good
VTH_PGLH
VTH_PGHL
IPGOOD
VFB rising, PGOOD from low to high
VFB rising, PGOOD from high to low
VPGOOD = 0.5V
85
--
90
85
1
95
--
%
Power Good Threshold
mA
Power Good Sink Current
0.5
--
Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. θJA and θJC are measured or simulated at T = 25C based on the JEDEC 51-7 standard.
A
Note 5. θJA(EVB), ΨJC(TOP) and ΨJB are measured on a high effective-thermal-conductivity four-layer test board which is in size
of 70mm x 50mm; furthermore, all layers with 1 oz. Cu. Thermal resistance/parameter values may vary depending on
the PCB material, layout, and test environmental conditions.
Copyright © 2020 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
10
DS6263A/B-00 January 2020
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
