RT6203E
Four-layer or six-layer PCB with maximum ground plane
is strongly recommended for good thermal performance.
The feedback trace is on bottom layer and
COUT5
COUT4
COUT3
COUT2
shielded by GND plane of inner layer.
Input capacitors must be placed as
close to IC VIN-GND as possible
C
OUT1
C
IN3
C
IN2
Keep analog components away from the BOOT
nodes.
C
IN1
EN
8
7
6
5
L
2
3
4
C
VCC
GND
C
BOOT
9
Add 12 thermal vias with 0.25mm diameter on
exposed pad for thermal dissipation and current
carrying capacity. Suggest inner layers are GND
plane.
SW should be connected to inductor by wide and short trace.
Keep sensitive components away from this trace .
SDA
SCL
Keep digital signal away from the noise traces and shielded by GND
plane.
Extend the GND plane for better thermal
dissipation.
Figure 7. PCB Layout Guide
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is a registered trademark of Richtek Technology Corporation.
©
DS6203E-00 January 2019
www.richtek.com
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