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RT6158A 参数 Datasheet PDF下载

RT6158A图片预览
型号: RT6158A
PDF下载: 下载PDF文件 查看货源
内容描述: [暂无描述]
分类和应用:
文件页数/大小: 14 页 / 282 K
品牌: RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
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RT6158A  
Protection  
Type  
Threshold Refer  
to Electrical Spec.  
Protection Method  
Shut Down Delay Time  
Reset Method  
IL < 4.5A  
CL will trigger right  
away.  
OCP  
IL > 4.5A  
Turn on B, D MOS  
UVLO  
OTP  
VIN < 2.05V  
Shutdown  
100s  
VIN > 2.15V  
TEMP > 160°C  
Shutdown  
No delay  
No delay  
No delay  
OTP Hysteresis = 20°C  
VOUT < 5.3V  
Output OVP VOUT > 5.6V  
SCP VOUT < 1.2V  
Stop switching  
fSW become 1/4  
After FAULT 40ms  
If the RT6158A operates in Buck mode, the worst-case  
voltage ripple occurs at the highest input voltage. When  
the Buck-boost operates in Boost mode, the worst-case  
voltage ripple occurs at the lowest input voltage. A  
capacitor with a value in the range of the calculated  
minimum should be used. This is required to maintain  
control loop stability. There are no additional requirements  
regarding minimum ESR. Low ESR capacitors should be  
used to minimize output voltage ripple. Larger capacitors  
will cause lower output voltage ripple as well as lower  
output voltage drop during load transients.  
Over-Temperature Protection  
The device has a built-in temperature sensor which  
monitors the internal junction temperature. If the  
temperature exceeds the OTP threshold, the device stops  
operating and enters shutdown mode. As soon as the IC  
temperature decreases below the threshold with a  
hysteresis, it starts operating again.  
Over-Voltage Protection  
When the VOUT pin is floating, the device will trigger the  
over-voltage protection to avoid the output voltage  
exceeding critical values for device. In case it reaches the  
OVP threshold, the device will regulate the output voltage  
to this value.  
Thermal Considerations  
The junction temperature should never exceed the  
absolute maximum junction temperature TJ(MAX), listed  
under Absolute Maximum Ratings, to avoid permanent  
damage to the device. The maximum allowable power  
dissipation depends on the thermal resistance of the IC  
package, the PCB layout, the rate of surrounding airflow,  
and the difference between the junction and ambient  
temperatures. The maximum power dissipation can be  
calculated using the following formula :  
Inductor Selection  
The recommended power inductor is 1μH with over 4.5A  
saturation current rating. In applications, it needs to select  
an inductor with the low DCR for good performance and  
efficiency.  
Input and Output Capacitor Selection  
The input and output capacitors should be ceramic X5R  
type with low ESL and ESR. The recommended input  
capacitor value is 2 x 10μF. The recommended output  
capacitor value is 4 x 10μF.  
PD(MAX) = (TJ(MAX) TA) / θJA  
where TJ(MAX) is the maximum junction temperature, TA is  
the ambient temperature, and θJA is the junction-to-ambient  
thermal resistance.  
The output capacitor selection determines the output  
voltage ripple and transient response. It is recommended  
to use ceramic capacitors placed as close as possible to  
the VOUT and GND pins of the IC. If, for any reason, the  
application requires the use of large capacitors which  
cannot be placed close to the IC, using a small ceramic  
capacitor in parallel to the large one is recommended.  
This small capacitor should be placed as close as possible  
to the VOUT and GND pins of the IC.  
For continuous operation, the maximum operating junction  
temperature indicated under Recommended Operating  
Conditions is 125°C. The junction-to-ambient thermal  
resistance, θJA, is highly package dependent. For a WL-  
CSP-25B 2.07x2.33 (BSC) package, the thermal  
resistance, θJA, is 35.7°C/W on a standard JEDEC 51-7  
high effective-thermal-conductivity four-layer test board.  
Copyright 2019 Richtek Technology Corporation. All rights reserved.  
©
is a registered trademark of Richtek Technology Corporation.  
www.richtek.com  
10  
DS6158A-05 August 2019  
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