欢迎访问ic37.com |
会员登录 免费注册
发布采购

RT3668EB 参数 Datasheet PDF下载

RT3668EB图片预览
型号: RT3668EB
PDF下载: 下载PDF文件 查看货源
内容描述: [暂无描述]
分类和应用:
文件页数/大小: 30 页 / 1954 K
品牌: RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
 浏览型号RT3668EB的Datasheet PDF文件第1页浏览型号RT3668EB的Datasheet PDF文件第2页浏览型号RT3668EB的Datasheet PDF文件第3页浏览型号RT3668EB的Datasheet PDF文件第5页浏览型号RT3668EB的Datasheet PDF文件第6页浏览型号RT3668EB的Datasheet PDF文件第7页浏览型号RT3668EB的Datasheet PDF文件第8页浏览型号RT3668EB的Datasheet PDF文件第9页  
RT3668EB
Pin No.
24
25
26
27
Pin Name
VSEN_NB_IN
S5_OUT
LDO_OUT
FBA
Pin Function
This pin is connected to the output of VDDNB controller.
FCH power output.
LDO output.
LDO output voltage feedback input.
MUX control input. When the pin pulled high, the S5_OUT output voltage is
forced to VSEN_NB_IN pin voltage. If the pin pulled low, the S5_OUT output
voltage is forced to VSEN_NB_IN pin voltage when the VSEN_NB_IN
voltage is greater than LDO_OUT voltage; otherwise, the S5_OUT voltage is
forced to LDO_OUT pin voltage.
LDO power input.
No internal connection.
Bootstrap supply of phase1 for high side MOSFET. This pin powers high side
MOSFET driver.
Upper gate driver output of phase1. Connect this pin to the gate input of high
side MOSFET.
Switch nodes of high side driver for phase1. Connect this pin to high side
MOSFET Source together with the low side MOSFET Drain and the inductor.
Lower gate driver output of phase1. Connect this pin to the gate input of low
side MOSFET.
Driver power supply. Connect this pin to GND by the 2.2F ceramic capacitor
at least. The decoupling capacitor is as close controller as possible.
Lower gate driver output of phase2. Connect this pin to the gate input of low
side MOSFET.
Switch nodes of high side driver for phase2. Connect this pin to high side
MOSFET Source together with the low side MOSFET Drain and the inductor.
Upper gate driver output of phase2. Connect this pin to the gate input of high
side MOSFET.
Bootstrap supply of phase2 for high side MOSFET. This pin powers high side
MOSFET driver.
No internal connection.
Ground. The exposed pad must be soldered to a large PCB and connected
to GND for maximum power dissipation.
28
MUX_CTRL
29
30
31
32
33
34
35
36
37
38
39
40
LDO_VIN
NC
BOOT1
UGATE1
PHASE1
LGATE1
PVCC
LGATE2
PHASE2
UGATE2
BOOT2
NC
41 (Exposed Pad) GND
Copyright © 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
4
DS3668EB-05
August 2019