Preliminary
RF2196
Pin
1
Function Description
Interface Schematic
This pin is internally grounded to the die flag.
GND
Power Down control for first stage. Regulated voltage supply for ampli-
2
VREG1
fier bias. In Power Down mode, both V
and V
need to be LOW
REG
MODE
(<0.5V).
For nominal operation (High Gain Mode), V
HIGH, the driver and final are dynamically scaled to reduce the device
size and as a result to reduce idle current.
is set LOW. When set
3
4
MODE
MODE
2
Power Down control for the second stage. Regulated voltage supply for
amplifier bias. In Power Down mode, both V
VREG2
and V
need to be
REG
MODE
LOW (<0.5V).
Connect to ground plane via 15nH inductor. DC return for the second
stage bias circuit.
5
6
GND
NC
This pin has no internal bonding; therefore, this pin can be connected
to output pin 7, connected to the ground plane, or not connected. Slight
tuning of the output match may be required due to stray capacitance of
the pin.
RF output and power supply for final stage. This is the unmatched col-
lector output of the second stage. A DC block is required following the
matching components. The biasing may be provided via a parallel L-C
set for resonance at the operating frequency of 1710MHz to 1910MHz.
It is important to select an inductor with very low DC resistance with a
1A current rating. Alternatively, shunt microstrip techniques are also
applicable and provide very low DC resistance. Low frequency bypass-
ing is required for stability.
7
RF OUT
RF OUT
From Bias
Network
Same as pin 7.
See pin 7.
8
9
RF OUT
GND
This pin is internally grounded to the die flag.
Supply for bias reference and control circuits. High frequency bypass-
ing may be necessary.
10
VCC
Power supply for first stage and interstage match. Pins 11 and 12
should be connected by a common trace where the pins contact the
printed circuit board.
11
VCC1
Same as pin 11.
12
13
VCC1
NC
It is recommended that these pins be connected to the ground plane for
improved isolation between RF IN (pin 16) and the VCC1 pins (pins 11
and 12).
It is recommended that these pins be connected to the ground plane for
improved isolation between RF IN (pin 16) and the VCC1 pins (pins 11
and 12).
14
15
16
NC
NC
It is recommended that these pins be connected to the ground plane for
improved isolation between RF IN (pin 16) and the VCC1 pins (pins 11
and 12).
RF input. An external 15pF series capacitor is required as a DC block.
In addition, the matching circuit shown is required to improve input
VSWR.
RF IN
VCC1
15 pF
TL
RF IN
3.6 pF
GND1
From
Bias
Stages
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
Pkg
Base
GND
2-206
Rev A0 010518
RFMD [ RF MICRO DEVICES ]
