AN0013
Note there is significant temperature rise from the baseplate temperature under nominal operating condition. This rise is
of the order of 30°C to 55°C above the baseplate temperature (85°C), depending on the device.
Additionally, the MPGA package style provides improved thermal performance. Device junction temperatures for NBB
parts tested in the MPGA package styles show a reduced junction temperature.
In conclusion, all NBB series and NDA series packaged parts operated at nominal bias with a baseplate temperature of
85°C (maximum recommended baseplate temperature) show an average junction temperature well below the 150°C rec-
ommended device junction temperature limit. Hence all NBB series and NDA series packaged parts provide a mean time
to failure greater than 1 million hours under these conditions.
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Copyright 1997-2002 RF Micro Devices, Inc.
RFMD [ RF MICRO DEVICES ]
