AN0013
Figure 2. NBB-300 Packaged Die Thermal Image
An example of some results of testing for NBB series and NDA series devices in each package style is given below for a
baseplate temperature of 85°C. The results shown are the average junction temperature of the sample measured.
Table 1. NBB Series Micro-X Packaged Junction Temperatures
Part
Base
Low
Nominal
Limiting
Number
Temperature
Id
mA
Tj
∆Tj
Id
mA
Tj
∆Tj
Id
mA
Tj
Tj∆
o
o
o
o
o
o
o
C
C
C
C
C
C
C
NBB-300
NBB-400
NBB-500
85
85
85
25 105.2 20.2
50 138.0 53.0
47 131.2 46.2
35 120.3 35.3
57 150.2 65.2
58 150.2 65.2
53 150.2 65.2
15
Table 2. NBB Series MPGA Packaged Junction Temperatures
Part
Base
Low
Nominal
Limiting
Number
Temperature
Id
mA
Tj
∆Tj
Id
mA
Tj
∆Tj
Id
mA
Tj
Tj∆
o
o
o
o
o
o
o
C
C
C
C
C
C
C
NBB-302
NBB-502
85
85
36 107.6 22.6
20 97.9 12.9
50 124.8 39.8
35 114.3 29.3
67 151.4 66.4
57 150.7 65.7
Table 3. NDA Series MPGA Packaged Junction Temperatures
Id1
mA
Id2
mA
Tj
∆Tj
Id1
mA
Id2
mA
Tj
∆Tj
Id1
mA
Id2
mA
Tj
∆Tj
o
o
o
o
o
o
C
C
C
C
C
C
NDA-212
NDA-312
NDA-412
85
85
85
29
29
29
36 133.1 48.1
42 139.9 54.9
36 140.0 55.0
32
31
55 150.4 65.4
55 151.0 66.0
28
36 133.9 48.9
Copyright 1997-2002 RF Micro Devices, Inc.
15-31
RFMD [ RF MICRO DEVICES ]
