CGA-6618(Z)
Pin
1
Function
RF IN
Description
Device 1. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.
Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as
possible.
2, 3,
6, 7
4
GND
Device 2. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.
RF IN
Device 2. RF output and bias pin. Bias should be supplied to this pin through an external series resistor and RF
choke inductor. Because DC biasing is present on this pin, a DC-blocking capacitor should be used in most appli-
cations. The supply side of the bias network should be well bypassed.
5
RF OUT/VCC
Device 1. Same as pin 5.
8
RF OUT/VCC
GND
Exposed area on the bottom side of the package must be soldered to the ground plane of the board for optimum
thermal and RF performance. Several vias should be located under the EPAD as shown in the recommended
land pattern.
EPAD
Suggested Pad Layout
PCB Pad Layout
Dimensions in inches [millimeters]
Sized for 31 mil thick FR-4
Package Drawing and Marking
Dimensions in inches (millimeters)
Refer to drawing posted at www.rfmd.com for tolerances.
PACKAGE TYPE:
TOP VIEW
BOTTOM VIEW
ESOP-8
8
7
6
5
Lot Code
CGA6618
.112
[2.85]
.155 [3.937]
.088 [2.25]
.236 [5.994]
EXPOSED PAD
.061 [1.549]
1
4
2
3
.194 [4.93]
.050 [1.27]
.016 [.406]
.061 [1.549]
DETAIL A
.013 [.33] x 45°
.
058 [1.473]
PARTING LINE
.008
[.203]
.194 [4.928]
.155 [3.937]
.025
SEATING
PLANE
.003 [.076]
5°
SEE DE
TAIL A
SIDE VIEW
END
VIEW
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
EDS-101993 Rev L
9 of 10
RFMD [ RF MICRO DEVICES ]
